Middle of line structures
The present disclosure generally relates to semiconductor structures and, more particularly, to middle of line structures and methods of manufacture. The structure includes: a plurality of gate structures comprising source and/or drain metallization features; spacers on sidewalls of the gate structu...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
13.04.2021
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Subjects | |
Online Access | Get full text |
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Summary: | The present disclosure generally relates to semiconductor structures and, more particularly, to middle of line structures and methods of manufacture. The structure includes: a plurality of gate structures comprising source and/or drain metallization features; spacers on sidewalls of the gate structures and composed of a first material and a second material; and contacts in electrical contact with the source and/or drain metallization features, and separated from the gate structures by the spacers. |
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Bibliography: | Application Number: US202016742981 |