Middle of line structures

The present disclosure generally relates to semiconductor structures and, more particularly, to middle of line structures and methods of manufacture. The structure includes: a plurality of gate structures comprising source and/or drain metallization features; spacers on sidewalls of the gate structu...

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Bibliographic Details
Main Authors Xu, Guowei, Zang, Hui, Tabakman, Keith, Sardesai, Viraj
Format Patent
LanguageEnglish
Published 13.04.2021
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Summary:The present disclosure generally relates to semiconductor structures and, more particularly, to middle of line structures and methods of manufacture. The structure includes: a plurality of gate structures comprising source and/or drain metallization features; spacers on sidewalls of the gate structures and composed of a first material and a second material; and contacts in electrical contact with the source and/or drain metallization features, and separated from the gate structures by the spacers.
Bibliography:Application Number: US202016742981