Substrate processing apparatus, substrate processing system, and substrate processing method

A top plate when located at a first position is held by an opposing-member holder, and the top plate when located at a second position is held by a substrate holder and rotated along with the substrate holder. In a substrate processing apparatus, a first processing liquid nozzle located at a supply...

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Bibliographic Details
Main Authors Takahashi, Mitsukazu, Muramoto, Ryo
Format Patent
LanguageEnglish
Published 30.03.2021
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A top plate when located at a first position is held by an opposing-member holder, and the top plate when located at a second position is held by a substrate holder and rotated along with the substrate holder. In a substrate processing apparatus, a first processing liquid nozzle located at a supply position inside a to-be-held part of the top plate supplies a first processing liquid through an opposing-member opening to a substrate and is moved from the supply position to its retracted position, and a second processing liquid nozzle is moved from its retracted position to the supply position and supplies a second processing liquid through the opposing-member opening to the substrate. This configuration suppresses or prevents mixture of multiple types of processing liquids, as compared with the case where multiple types of processing liquids are sequentially supplied from a single processing liquid nozzle.
Bibliography:Application Number: US201815977124