High-frequency module
A high-frequency module (1) includes a substrate (10), a first electronic component (13) and a second electronic component (14) that are provided on the substrate (10), an insulating layer (15) that covers a part of a side surface of the first electronic component (13) and a side surface and a top s...
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Main Author | |
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Format | Patent |
Language | English |
Published |
16.03.2021
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Subjects | |
Online Access | Get full text |
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Summary: | A high-frequency module (1) includes a substrate (10), a first electronic component (13) and a second electronic component (14) that are provided on the substrate (10), an insulating layer (15) that covers a part of a side surface of the first electronic component (13) and a side surface and a top surface of the second electronic component (14), and a heat-dissipating layer (16) that covers at least a top surface of the first electronic component (13) and a portion of the side surface of the first electronic component (13) excluding the portion of the side surface of the first electronic component (13) in contact with the insulating layer (15). |
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Bibliography: | Application Number: US201916374194 |