Fragmenting computer chips

A method comprising bonding a first substrate to a second substrate. The first substrate includes a layer of one or more pairs of reactive material. The method comprising triggering a reaction between the one or more pairs of reactive material and fragmenting the second substrate.

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Bibliographic Details
Main Authors Cabral, Jr., Cyril, Rodbell, Kenneth P
Format Patent
LanguageEnglish
Published 09.03.2021
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CHEMISTRY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
EXPLOSIVES
EXPLOSIVES OR THERMIC COMPOSITIONS
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MANUFACTURE THEREOF
MATCHES
METALLURGY
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
USE OF SINGLE SUBSTANCES AS EXPLOSIVES
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Summary:A method comprising bonding a first substrate to a second substrate. The first substrate includes a layer of one or more pairs of reactive material. The method comprising triggering a reaction between the one or more pairs of reactive material and fragmenting the second substrate.
Bibliography:Application Number: US201916354286