Aluminum based solderable contact

A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer f...

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Bibliographic Details
Main Authors Wu, Yiliang, Sachs, Soenke, Soneja, Shallu, Gulsoy, Gokce, Greiner, Felix, Zhou, Xiao, Schmidt, Helge
Format Patent
LanguageEnglish
Published 02.03.2021
Subjects
CLADDING OR PLATING BY SOLDERING OR WELDING
COLOUR PRINTING
CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING
LINING MACHINES
MACHINE TOOLS
METAL-WORKING NOT OTHERWISE PROVIDED FOR
PERFORMING OPERATIONS
PRINTING
PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES
SOLDERING OR UNSOLDERING
STAMPS
TRANSPORTING
TYPEWRITERS
WELDING
WORKING BY LASER BEAM
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Summary:A method of producing a solderable aluminum contact comprises formulating an ink, applying the ink to an aluminum substrate to form an ink layer on a surface of the aluminum substrate, and melting the ink layer. The ink includes a solderable element that is conductive. The melting of the ink layer forms an alloy on the surface of the aluminum substrate including the solderable element.
Bibliography:Application Number: US201816185841