Semiconductor device, and method for manufacturing semiconductor device

There are included: a substrate; a semiconductor laser part formed on the substrate by stacking a plurality of layers including an active layer; and an adjacent part formed on the substrate by stacking a plurality of layers including a core layer, and being an optical modulator or an optical wavegui...

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Bibliographic Details
Main Author Kawahara, Hiroyuki
Format Patent
LanguageEnglish
Published 26.01.2021
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Summary:There are included: a substrate; a semiconductor laser part formed on the substrate by stacking a plurality of layers including an active layer; and an adjacent part formed on the substrate by stacking a plurality of layers including a core layer, and being an optical modulator or an optical waveguide in contact with the semiconductor laser part through butt joint joining thereto. In a semiconductor device including the semiconductor laser part and the adjacent part which are joined in a butt joint manner, at least a portion, of the semiconductor laser part, that is contact with the adjacent part is disordered.
Bibliography:Application Number: US201716490664