Polishing pad and polishing method

To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to...

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Bibliographic Details
Main Authors Tahara, Muneaki, Morinaga, Hitoshi, Asai, Maiko, Tamai, Kazusei, Ito, Yuuichi
Format Patent
LanguageEnglish
Published 05.01.2021
Subjects
DRESSING OR CONDITIONING OF ABRADING SURFACES
FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
GRINDING
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING
PERFORMING OPERATIONS
POLISHING
TRANSPORTING
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Summary:To provide a polishing pad capable of sufficiently polishing, in polishing of an object to be polished having at least one of a projection portion and a recessed portion on the surface, a portion near the projection portion or the inner surface of the recessed portion of the surface of the object to be polished. The polishing pad has a piloerection portion (1) in which a plurality of fibers (12) having a length of 2 mm or more are raised on the surface of a base (11), in which the mass of the fibers (12) is 250 g/m2 or more. The polishing pad is used for polishing an object to be polished (2) containing metal, an alloy, or a metal oxide material and having at least one of a projection portion (21) and a recessed portion (22) on the surface.
Bibliography:Application Number: US201615744460