Hard rolled-copper foil and method of manufacturing the hard rolled-copper foil

• Main Authors: Sasai, Yuta, Morioka, Nobuaki, Fukuda, Eri
• Format: Patent
• Language: English
• Published: 05.01.2021
• Subjects: CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHANGING THE PHYSICAL STRUCTURE OF NON-FERROUS METALS ANDNON-FERROUS ALLOYS; CHEMISTRY; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FERROUS OR NON-FERROUS ALLOYS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MECHANICAL METAL-WORKING WITHOUT ESSENTIALLY REMOVINGMATERIAL; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; PUNCHING METAL; ROLLING OF METAL; TRANSPORTING; TREATMENT OF ALLOYS OR NON-FERROUS METALS

A hard rolled-copper foil which, when heated and laminated on an insulating resin base material, can exhibit excellent bend-resistance characteristics without increasing a final reduction ratio, which, being not prone to develop rolling marks, can maintain a low surface coarseness and can therefore be preferably used in a flexible printed wiring board having excellent high-speed transmission characteristics, which is not prone to softening at room temperature, and which provides excellent operation efficiency and foil passing property when being processed into a flexible printed wiring board after having been stored. A hard rolled-copper foil in which a crystal orientation density in a copper orientation is not less than 10, and a crystal orientation density in a brass orientation is not less than 20.