Apparatus for collection and subsequent reaction of liquid and solid effluent into gaseous effluent

Embodiments disclosed herein include an abatement system for abating compounds produced in semiconductor processes. The abatement system includes an exhaust cooling apparatus located downstream of a plasma source. The exhaust cooling apparatus includes a plate and a cooling plate disposed downstream...

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Bibliographic Details
Main Authors Hou, David Muquing, L'Heureux, James, Downey, Ryan T, Rozenzon, Yan
Format Patent
LanguageEnglish
Published 08.12.2020
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Summary:Embodiments disclosed herein include an abatement system for abating compounds produced in semiconductor processes. The abatement system includes an exhaust cooling apparatus located downstream of a plasma source. The exhaust cooling apparatus includes a plate and a cooling plate disposed downstream of the plate. During operation, materials collected on the plate react with cleaning radicals to form a gas. The temperature of the plate is higher than the temperature of the cooling plate in order to improve the reaction rate of the reaction of the cleaning radicals and the materials on the plate.
Bibliography:Application Number: US201815961482