Substrate package having variable marking

Disclosed are a substrate package, a method of fabricating the substrate package, and a system including the substrate package. The substrate package includes a stack of substrate sheets in an individual form, a continuous form, or a roll form. The stack has a sidewall defined by edges of the substr...

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Bibliographic Details
Main Authors Williams, Antonio St. Clair Lloyd, Mosko, Marc E, Veres, Janos
Format Patent
LanguageEnglish
Published 08.12.2020
Subjects
CONVEYING
CORRECTION OF TYPOGRAPHICAL ERRORS
HANDLING THIN OR FILAMENTARY MATERIAL
HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS,CABLES
i.e. MECHANISMS PRINTING OTHERWISE THAN FROM A FORME
LINING MACHINES
PACKING
PERFORMING OPERATIONS
PRINTING
SELECTIVE PRINTING MECHANISMS
STAMPS
STORING
TRANSPORTING
TYPEWRITERS
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Summary:Disclosed are a substrate package, a method of fabricating the substrate package, and a system including the substrate package. The substrate package includes a stack of substrate sheets in an individual form, a continuous form, or a roll form. The stack has a sidewall defined by edges of the substrate sheets and a mark on the sidewall includes mark segments on respective edges. The mark segments vary such that one or more of the mark segments have a respective segment characteristic, such as a length. The segment characteristic can encode information about an attribute of the substrate sheet, such as a physical characteristic of the sheet.
Bibliography:Application Number: US202016751041