Multilayer structures, multilayer films, and packages formed therefrom

Embodiments relate to multilayer structures, multilayer films, and packages formed therefrom. As an example, a multilayer structure can include a multilayer structure comprising a polyolefin sealant layer, a coupling layer on the polyolefin sealant layer, where the coupling layer includes a polyolef...

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Bibliographic Details
Main Authors Carioli, Rafaela De Foggi, Mazzola, Nicolas Cardoso, Cantu, Marcelo Delmar, Gomes, Jorge Caminero, Gargalaka, Jr., João
Format Patent
LanguageEnglish
Published 08.12.2020
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Summary:Embodiments relate to multilayer structures, multilayer films, and packages formed therefrom. As an example, a multilayer structure can include a multilayer structure comprising a polyolefin sealant layer, a coupling layer on the polyolefin sealant layer, where the coupling layer includes a polyolefin and a maleic anhydride grafted (MAH) polymer, where the total amount of MAH polymer is from 15 weight percent to 50 weight percent of a total weight percent of the coupling layer, where the polyolefin is selected from the group consisting of a high pressure low density polyethylene, a high density polyethylene, an ethylene acrylic acid copolymer, an ethylene(meth)acrylic acid copolymer, propylene based plastomers, ionomers or a combination thereof, and a barrier layer directly on the coupling layer.
Bibliography:Application Number: US201716321134