Electronic devices with bond pads formed on a molybdenum layer

An electronic device comprises: a molybdenum layer; a bond pad formed on the molybdenum layer, the bond pad comprising aluminum; and a wire bonded to the bond pad, the wire comprising gold.

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Bibliographic Details
Main Authors Goodlin, Brian E, Jackson, Ricky Alan, Yen, Ting-Ta
Format Patent
LanguageEnglish
Published 17.11.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electronic device comprises: a molybdenum layer; a bond pad formed on the molybdenum layer, the bond pad comprising aluminum; and a wire bonded to the bond pad, the wire comprising gold.
Bibliography:Application Number: US201815898694