Nanoparticles for improving the dimensional stability of resins

• Main Authors: Meure, Samuel J, Kozar, Michael P, Wilenski, Mark S
• Format: Patent
• Language: English
• Published: 20.10.2020
• Subjects: AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G; BASIC ELECTRIC ELEMENTS; CABLES; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; CONDUCTORS; ELECTRICITY; GENERAL PROCESSES OF COMPOUNDING; INSULATORS; LAYERED PRODUCTS; LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; WORKING-UP

A composition may include the resin and a plurality of polymer nanoparticles included in the resin to form a resin mixture. The resin may have a resin coefficient of thermal expansion (CTE), a resin cure shrinkage, and/or a resin heat of reaction. The polymer nanoparticles may have a nanoparticle cure shrinkage less than the resin cure shrinkage, a nanoparticle CTE different than the resin CTE, and/or a nanoparticle heat of reaction less than the resin heat of reaction.