Nanoparticles for improving the dimensional stability of resins

A composition may include the resin and a plurality of polymer nanoparticles included in the resin to form a resin mixture. The resin may have a resin coefficient of thermal expansion (CTE), a resin cure shrinkage, and/or a resin heat of reaction. The polymer nanoparticles may have a nanoparticle cu...

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Bibliographic Details
Main Authors Meure, Samuel J, Kozar, Michael P, Wilenski, Mark S
Format Patent
LanguageEnglish
Published 20.10.2020
Subjects
AFTER-TREATMENT NOT COVERED BY SUBCLASSES C08B, C08C, C08F,C08G
BASIC ELECTRIC ELEMENTS
CABLES
CHEMISTRY
COMPOSITIONS BASED THEREON
COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
CONDUCTORS
ELECTRICITY
GENERAL PROCESSES OF COMPOUNDING
INSULATORS
LAYERED PRODUCTS
LAYERED PRODUCTS, i.e. PRODUCTS BUILT-UP OF STRATA OF FLAT ORNON-FLAT, e.g. CELLULAR OR HONEYCOMB, FORM
METALLURGY
ORGANIC MACROMOLECULAR COMPOUNDS
PERFORMING OPERATIONS
SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES
THEIR PREPARATION OR CHEMICAL WORKING-UP
TRANSPORTING
WORKING-UP
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Summary:A composition may include the resin and a plurality of polymer nanoparticles included in the resin to form a resin mixture. The resin may have a resin coefficient of thermal expansion (CTE), a resin cure shrinkage, and/or a resin heat of reaction. The polymer nanoparticles may have a nanoparticle cure shrinkage less than the resin cure shrinkage, a nanoparticle CTE different than the resin CTE, and/or a nanoparticle heat of reaction less than the resin heat of reaction.
Bibliography:Application Number: US201414493371