Semiconductor device package and method of manufacturing the same

A semiconductor packaging device includes a first patterned insulation layer, a patterned conductive layer, a semiconductor device and an encapsulant. The first patterned insulation layer has a first surface, a second surface opposite the first surface, and an island portion having the first surface...

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Bibliographic Details
Main Authors Lu, Wen-Long, Chang, Huang-Hsien
Format Patent
LanguageEnglish
Published 06.10.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor packaging device includes a first patterned insulation layer, a patterned conductive layer, a semiconductor device and an encapsulant. The first patterned insulation layer has a first surface, a second surface opposite the first surface, and an island portion having the first surface. The first patterned insulation layer defines a tapered groove surrounding the island portion. The patterned conductive layer is disposed on the first surface of the island portion. The semiconductor device electrically connects to the patterned conductive layer. The encapsulant encapsulates the semiconductor device, the first patterned insulation layer and the patterned conductive layer.
Bibliography:Application Number: US201816182588