Wafer level encapsulation for MEMS device

A microelectromechanical system (MEMS) device is disclosed. The MEMS device includes a device substrate having a MEMS component in a device region. A top cap is fusion bonded to the top surface of the device substrate and a bottom cap is fusion bonded to the bottom surface of the device substrate. T...

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Bibliographic Details
Main Authors Ng, Yu Ting, Rajasekaran, Natarajan, Kumar, Rakesh, Chakravarty, Siddharth, Yelehanka, Pradeep
Format Patent
LanguageEnglish
Published 06.10.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MICROSTRUCTURAL DEVICES OR SYSTEMS, e.g. MICROMECHANICALDEVICES
MICROSTRUCTURAL TECHNOLOGY
PERFORMING OPERATIONS
PROCESSES OR APPARATUS SPECIALLY ADAPTED FOR THE MANUFACTUREOR TREATMENT OF MICROSTRUCTURAL DEVICES OR SYSTEMS
SEMICONDUCTOR DEVICES
TRANSPORTING
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Summary:A microelectromechanical system (MEMS) device is disclosed. The MEMS device includes a device substrate having a MEMS component in a device region. A top cap is fusion bonded to the top surface of the device substrate and a bottom cap is fusion bonded to the bottom surface of the device substrate. The top and bottom caps encapsulate the MEMS components. A cap includes a via isolation which extends a thickness of the cap and surrounds the device region.
Bibliography:Application Number: US201715810156