Integrated circuit controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA)

Methods, systems, and apparatuses are described for integrated circuit-controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA). A unique Integrated Circuit (IC) die ejection head assembly system is described, which utilizes Three-Dimensional (3D) Printing/Etchin...

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Bibliographic Details
Main Authors Arneson, Michael R, Bandy, William R
Format Patent
LanguageEnglish
Published 29.09.2020
Subjects
ANTENNAS, i.e. RADIO AERIALS
BASIC ELECTRIC ELEMENTS
CALCULATING
COMPUTING
COUNTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
HANDLING RECORD CARRIERS
PHYSICS
PRESENTATION OF DATA
RECOGNITION OF DATA
RECORD CARRIERS
SEMICONDUCTOR DEVICES
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Summary:Methods, systems, and apparatuses are described for integrated circuit-controlled ejection system (ICCES) for massively parallel integrated circuit assembly (MPICA). A unique Integrated Circuit (IC) die ejection head assembly system is described, which utilizes Three-Dimensional (3D) Printing/Etching to achieve very high-resolution manufacturing to meet the precision tolerances required for very small IC die sizes.
Bibliography:Application Number: US201916290561