Method for manufacturing busbar assembly

• Main Authors: Nakagawa, Masaya, Wakabayashi, Shojiro
• Format: Patent
• Language: English
• Published: 22.09.2020
• Subjects: APPARATUS THEREFOR; APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TO SURFACES, IN GENERAL; BASIC ELECTRIC ELEMENTS; CABLES; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; CHEMISTRY; CONDUCTORS; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER; CURRENT COLLECTORS; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; ELECTROFORMING; ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; GENERATION; INSTALLATION OF ELECTRIC CABLES OR LINES, OR OF COMBINEDOPTICAL AND ELECTRIC CABLES OR LINES; INSULATORS; LINE CONNECTORS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; METALLURGY; PERFORMING OPERATIONS; PRINTED CIRCUITS; PROCESSES FOR APPLYING LIQUIDS OR OTHER FLUENT MATERIALS TOSURFACES, IN GENERAL; PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTIONOF COATINGS; SELECTION OF MATERIALS FOR THEIR CONDUCTIVE, INSULATING ORDIELECTRIC PROPERTIES; SPRAYING OR ATOMISING IN GENERAL; TRANSPORTING

A manufacturing method according to the present invention includes: a step of providing a first conductive metal flat plate; a step of forming a slit in a busbar assembly forming region of the flat plate; a step of coating the flat plate with a coating material containing an insulating resin such that at least the slit is filled with the insulating resin layer; a step of curing the coating material to form the insulating resin layer; and a cutting step of cutting off the insulating resin layer in the slit and busbar forming parts of the first conductive metal flat plate from the first conductive metal flat plate, wherein the busbar forming parts face each other with the slit therebetween.