Semiconductor sensor chip, semiconductor sensor chip array, and ultrasound diagnostic apparatus

• Main Authors: Yoshimura, Yasuhiro, Sako, Akifumi, Nagata, Tatsuya, Yamashita, Naoaki
• Format: Patent
• Language: English
• Published: 22.09.2020
• Subjects: BASIC ELECTRIC ELEMENTS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; FOR PERFORMING MECHANICAL WORK IN GENERAL; GENERATING OR TRANSMITTING MECHANICAL VIBRATIONS IN GENERAL; METHODS OR APPARATUS FOR GENERATING OR TRANSMITTING MECHANICALVIBRATIONS OF INFRASONIC, SONIC, OR ULTRASONIC FREQUENCY; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; TRANSPORTING

The present invention addresses the problem of enlarging a sensing area in an ultrasonic probe so as to achieve a higher definition. This ultrasonic diagnostic equipment is provided with an ultrasonic probe that comprises: a CMUT chip (2a) that has drive electrodes (3e)-(3j), etc., arranged in a grid-like configuration on a rectangular CMUT element section (21); and a CMUT chip (2b) that has drive electrodes (3p)-(3u), etc., arranged in a grid-like configuration on the rectangular CMUT element section (21), that is adjacent to the CMUT chip (2a), and in which the drive electrodes (3e)-(3j) of the adjacent CMUT chip (2a) are electrically connected to the respective drive electrodes (3p)-(3u) via bonding wires (4f)-(4i), etc.