Electronic component embedded printed circuit board and method of manufacturing the same

A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the elec...

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Bibliographic Details
Main Authors Park, Ho-Sik, Lee, Sang-Jae, Lim, Sung-Taek, Lee, Dong-Keun, Choi, Jae-Hoon
Format Patent
LanguageEnglish
Published 15.09.2020
Subjects
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:A printed circuit board and method thereof include an electronic component embedded in an insulation layer and comprising a connection terminal exposed on a surface of the insulation layer. The printed circuit board and method thereof also include a bump formed on the connection terminal of the electronic component and exposed on the surface of the insulation layer.
Bibliography:Application Number: US201615003400