Semiconductor package device for power device

A semiconductor package device includes a first die having a first surface and a second surface opposite to the first surface, and a first adhesive layer disposed on the first surface of the first die. The semiconductor package device further includes an encapsulant layer encapsulating the first die...

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Bibliographic Details
Main Authors Essig, Kay Stefan, Appelt, Bernd Karl
Format Patent
LanguageEnglish
Published 15.09.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package device includes a first die having a first surface and a second surface opposite to the first surface, and a first adhesive layer disposed on the first surface of the first die. The semiconductor package device further includes an encapsulant layer encapsulating the first die and the first adhesive layer, and a first conductive via disposed in the first adhesive layer and electrically connected to the first die.
Bibliography:Application Number: US201715649543