Multi-camera processor with feature matching

An embodiment of a semiconductor package apparatus may include technology to capture two or more concurrent images of a scene with two or more cameras, detect a feature in a first image from a first camera of the two or more cameras, match the feature in a second image from a second camera of the tw...

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Bibliographic Details
Main Authors Kumar, Avinash, Gururaj, Manjula, Narayanswamy, Ramkumar
Format Patent
LanguageEnglish
Published 01.09.2020
Subjects
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