Multi-camera processor with feature matching
An embodiment of a semiconductor package apparatus may include technology to capture two or more concurrent images of a scene with two or more cameras, detect a feature in a first image from a first camera of the two or more cameras, match the feature in a second image from a second camera of the tw...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
01.09.2020
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Subjects | |
Online Access | Get full text |
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