Multi-camera processor with feature matching

An embodiment of a semiconductor package apparatus may include technology to capture two or more concurrent images of a scene with two or more cameras, detect a feature in a first image from a first camera of the two or more cameras, match the feature in a second image from a second camera of the tw...

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Bibliographic Details
Main Authors Kumar, Avinash, Gururaj, Manjula, Narayanswamy, Ramkumar
Format Patent
LanguageEnglish
Published 01.09.2020
Subjects
CALCULATING
COMPUTING
COUNTING
ELECTRIC COMMUNICATION TECHNIQUE
ELECTRICITY
IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
PHYSICS
PICTORIAL COMMUNICATION, e.g. TELEVISION
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Summary:An embodiment of a semiconductor package apparatus may include technology to capture two or more concurrent images of a scene with two or more cameras, detect a feature in a first image from a first camera of the two or more cameras, match the feature in a second image from a second camera of the two or more cameras, and perform a photometric calibration between the first camera and the second camera based on a portion of the first image corresponding to the detected feature and a portion of the second image corresponding to the matched feature. Other embodiments are disclosed and claimed.
Bibliography:Application Number: US201715858063