Three-dimensional semiconductor devices
A three-dimensional semiconductor device includes an upper structure on a lower structure, the upper structure including conductive patterns, a semiconductor pattern connected to the lower structure through the upper structure, and an insulating spacer between the semiconductor pattern and the upper...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
18.08.2020
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Subjects | |
Online Access | Get full text |
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Summary: | A three-dimensional semiconductor device includes an upper structure on a lower structure, the upper structure including conductive patterns, a semiconductor pattern connected to the lower structure through the upper structure, and an insulating spacer between the semiconductor pattern and the upper structure, a bottom surface of the insulating spacer being positioned at a vertical level equivalent to or higher than an uppermost surface of the lower structure. |
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Bibliography: | Application Number: US202016739417 |