Three-dimensional semiconductor devices

A three-dimensional semiconductor device includes an upper structure on a lower structure, the upper structure including conductive patterns, a semiconductor pattern connected to the lower structure through the upper structure, and an insulating spacer between the semiconductor pattern and the upper...

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Bibliographic Details
Main Authors Chang, Sung-Il, Park, Chanjin, Son, Byoungkeun, Lee, Changhyun
Format Patent
LanguageEnglish
Published 18.08.2020
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Summary:A three-dimensional semiconductor device includes an upper structure on a lower structure, the upper structure including conductive patterns, a semiconductor pattern connected to the lower structure through the upper structure, and an insulating spacer between the semiconductor pattern and the upper structure, a bottom surface of the insulating spacer being positioned at a vertical level equivalent to or higher than an uppermost surface of the lower structure.
Bibliography:Application Number: US202016739417