Measuring height difference in patterns on semiconductor wafers
An improved technique for determining height difference in patterns provided on semiconductor wafers uses real measurements (e.g., measurements from SEM images) and a height difference determination model. In one version of the model, a measurable variable of the model is expressed in terms of a fun...
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Main Authors | , , , , , , |
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Format | Patent |
Language | English |
Published |
18.08.2020
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Subjects | |
Online Access | Get full text |
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