Measuring height difference in patterns on semiconductor wafers

• Main Authors: Avniel, Yan, Kris, Roman, Baram, Mor, Girmonsky, Doron, Schwarzband, Ishai, Khristo, Sergey, Levi, Shimon
• Format: Patent
• Language: English
• Published: 18.08.2020
• Subjects: CALCULATING; COMPUTING; COUNTING; HANDLING RECORD CARRIERS; IMAGE DATA PROCESSING OR GENERATION, IN GENERAL; PHYSICS; PRESENTATION OF DATA; RECOGNITION OF DATA; RECORD CARRIERS

An improved technique for determining height difference in patterns provided on semiconductor wafers uses real measurements (e.g., measurements from SEM images) and a height difference determination model. In one version of the model, a measurable variable of the model is expressed in terms of a fun...