Ambient-light-sensing hole structure package and method of manufacturing the same

• Main Authors: Yu, Jing-Bing, Yao, Yen-Chang, Chia, Pang-Chiang, Chen, Chun-Hung, Chang, Ya-Ting, Huang, Yen-Heng, Lin, Tai-Wu
• Format: Patent
• Language: English
• Published: 18.08.2020
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; COLORIMETRY; COMBINED OPERATIONS; MACHINE TOOLS; MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT,POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRA-RED,VISIBLE OR ULTRA-VIOLET LIGHT; MEASURING; METAL-WORKING NOT OTHERWISE PROVIDED FOR; OTHER WORKING OF METAL; PERFORMING OPERATIONS; PHYSICS; RADIATION PYROMETRY; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; TESTING; TRANSPORTING; UNIVERSAL MACHINE TOOLS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

An ambient-light-sensing hole structure package and a method of manufacturing the same are provided. The ambient-light-sensing hole structure package includes a transparent cover, a decorative layer, a porous structure layer, and an optical adhesive. The transparent cover has a surface. The decorative layer is disposed on the surface and the decorative layer has an opening that exposes a portion of the surface. The porous structure layer is disposed on one side of the decorative layer and the porous structure layer covers the portion of the surface. The porous structure layer includes a plurality of through holes, and the through holes overlap with the opening. The optical adhesive is interposed between the decorative layer and the porous structure layer.