Rectangular via for ensuring via yield in the absence of via redundancy

A rectangular via extending between interconnects in different metallization levels can have a planform with a width equal to the width of the interconnects and a length equal to twice the width and can be aligned along a long dimension with a length of the upper interconnect. In an integrated circu...

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Bibliographic Details
Main Author Blatchford, James Walter
Format Patent
LanguageEnglish
Published 11.08.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A rectangular via extending between interconnects in different metallization levels can have a planform with a width equal to the width of the interconnects and a length equal to twice the width and can be aligned along a long dimension with a length of the upper interconnect. In an integrated circuit layout, the planform can be centered over the width of the lower interconnect, allowing for misalignment during fabrication while maintaining a robust electrical connection. The bottom of the via may be aligned with an upper surface of the lower interconnect or may include portions below the lower interconnect's upper surface. Fewer adjacent routing tracks are blocked by use of the rectangular via than would be blocked using redundant square vias, while ensuring reliability of the electrical connection despite potential misalignment during fabrication.
Bibliography:Application Number: US201213529583