Power package having multiple mold compounds

A semiconductor device package includes a lead frame, a first power semiconductor device mounted on a first part of the lead frame and a second power semiconductor device mounted on a second part of the lead frame. The first power semiconductor device is encapsulated by a first mold compound. The se...

Full description

Saved in:
Bibliographic Details
Main Authors Fuergut, Edward, Gruber, Martin
Format Patent
LanguageEnglish
Published 16.06.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

Abstract A semiconductor device package includes a lead frame, a first power semiconductor device mounted on a first part of the lead frame and a second power semiconductor device mounted on a second part of the lead frame. The first power semiconductor device is encapsulated by a first mold compound. The second power semiconductor device is encapsulated by a second mold compound. The first mold compound and the second mold compound are substantially separate from each other. The lead frame includes an intermediate part arranged between the first part and the second part. The intermediate part is not covered by the first mold compound or by the second mold compound.
AbstractList A semiconductor device package includes a lead frame, a first power semiconductor device mounted on a first part of the lead frame and a second power semiconductor device mounted on a second part of the lead frame. The first power semiconductor device is encapsulated by a first mold compound. The second power semiconductor device is encapsulated by a second mold compound. The first mold compound and the second mold compound are substantially separate from each other. The lead frame includes an intermediate part arranged between the first part and the second part. The intermediate part is not covered by the first mold compound or by the second mold compound.
Author Fuergut, Edward
Gruber, Martin
Author_xml – fullname: Fuergut, Edward
– fullname: Gruber, Martin
BookMark eNrjYmDJy89L5WTQCcgvTy1SKEhMzk5MT1XISCzLzEtXyC3NKcksyElVyM3PSVFIzs8tyC_NSynmYWBNS8wpTuWF0twMim6uIc4euqkF-fGpxUBDUvNSS-JDgw0NzCxMLQ0snYyMiVEDAJwGK_c
ContentType Patent
DBID EVB
DatabaseName esp@cenet
DatabaseTitleList
Database_xml – sequence: 1
  dbid: EVB
  name: esp@cenet
  url: http://worldwide.espacenet.com/singleLineSearch?locale=en_EP
  sourceTypes: Open Access Repository
DeliveryMethod fulltext_linktorsrc
Discipline Medicine
Chemistry
Sciences
ExternalDocumentID US10685909B2
GroupedDBID EVB
ID FETCH-epo_espacenet_US10685909B23
IEDL.DBID EVB
IngestDate Fri Jul 19 14:46:17 EDT 2024
IsOpenAccess true
IsPeerReviewed false
IsScholarly false
Language English
LinkModel DirectLink
MergedId FETCHMERGED-epo_espacenet_US10685909B23
Notes Application Number: US201715816090
OpenAccessLink https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200616&DB=EPODOC&CC=US&NR=10685909B2
ParticipantIDs epo_espacenet_US10685909B2
PublicationCentury 2000
PublicationDate 20200616
PublicationDateYYYYMMDD 2020-06-16
PublicationDate_xml – month: 06
  year: 2020
  text: 20200616
  day: 16
PublicationDecade 2020
PublicationYear 2020
RelatedCompanies Infineon Technologies AG
RelatedCompanies_xml – name: Infineon Technologies AG
Score 3.2672818
Snippet A semiconductor device package includes a lead frame, a first power semiconductor device mounted on a first part of the lead frame and a second power...
SourceID epo
SourceType Open Access Repository
SubjectTerms BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Title Power package having multiple mold compounds
URI https://worldwide.espacenet.com/publicationDetails/biblio?FT=D&date=20200616&DB=EPODOC&locale=&CC=US&NR=10685909B2
hasFullText 1
inHoldings 1
isFullTextHit
isPrint
link http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1ZS8NAEB5KFfVNq6L1YAXJk8Gcm-YhCLkoQttgG-lb6eYQr7SYiH_fmZBYX_Rt2YU9Bub4dr_ZAbgWPNP1pcblXM912chtRRboeeSlKRSB8VFqDygbeTTmw9i4n5vzDry0uTD1P6Ff9eeIqFEJ6ntV2-v15hLLr7mV5a14xq7VXThzfKlBx4SPVS75rhNEE3_iSZ7nxFNp_ICxLh-YtmK7aK63MIy2iP4VPLqUlbL-7VLCfdiOcLaiOoBOVvRg12srr_VgZ9Q8eGOz0b3yEG4iKmjGcLuvaAMYZdcXT6wlBLL31VvKiCBOdZLKI7gKg5k3lHHZxc8ZF_F0s0P9GLqI_bMTYLnFEyO1NJ6pOQKFBPGGRiAuQTeSYPBzCv2_5-n_N3gGeyQvYj2p_By61cdndoH-tRKXtWC-AYmNfqM
link.rule.ids 230,309,783,888,25578,76884
linkProvider European Patent Office
linkToHtml http://utb.summon.serialssolutions.com/2.0.0/link/0/eLvHCXMwfV1JS8NAFH6UKtabVkXrFkFyMph1mhyCkI2oTRpsIr2FZhO3tJiIf983IbFe9DbMwJuZB2_5Zt4CcJmQXJIWIuEKqZA4udB4LkHLwy2UhE_QP8o0lWYjez5xI_lursx78NLlwjR1Qr-a4ogoUSnKe93o69X6EctqYiur6-QZp5Y3TqhbbIuOKT4WCGsZuh1MranJmqYezVj_AX1doioarxmorjfQxVZpnX370aBZKavfJsXZgc0AqZX1LvTycggDs-u8NoQtr_3wxmEre9UeXAW0oRmDx31FHcDQ7PryiekCApn35VvG0ABx2iep2ocLxw5Nl8Nt4587xtFsfULpAPqI_fNDYIoxSeVsLJJcKBAopIg3RAriUjQjKTo_RzD6m87ov8VzGLihN4knt_79MWxT3tEIKIGcQL_--MxP0dbWyVnDpG-ha4GT
openUrl ctx_ver=Z39.88-2004&ctx_enc=info%3Aofi%2Fenc%3AUTF-8&rfr_id=info%3Asid%2Fsummon.serialssolutions.com&rft_val_fmt=info%3Aofi%2Ffmt%3Akev%3Amtx%3Apatent&rft.title=Power+package+having+multiple+mold+compounds&rft.inventor=Fuergut%2C+Edward&rft.inventor=Gruber%2C+Martin&rft.date=2020-06-16&rft.externalDBID=B2&rft.externalDocID=US10685909B2