Power package having multiple mold compounds

A semiconductor device package includes a lead frame, a first power semiconductor device mounted on a first part of the lead frame and a second power semiconductor device mounted on a second part of the lead frame. The first power semiconductor device is encapsulated by a first mold compound. The se...

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Bibliographic Details
Main Authors Fuergut, Edward, Gruber, Martin
Format Patent
LanguageEnglish
Published 16.06.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor device package includes a lead frame, a first power semiconductor device mounted on a first part of the lead frame and a second power semiconductor device mounted on a second part of the lead frame. The first power semiconductor device is encapsulated by a first mold compound. The second power semiconductor device is encapsulated by a second mold compound. The first mold compound and the second mold compound are substantially separate from each other. The lead frame includes an intermediate part arranged between the first part and the second part. The intermediate part is not covered by the first mold compound or by the second mold compound.
Bibliography:Application Number: US201715816090