Filling material, resin composition, package, and light-emitting device

• Main Authors: Okada, Koichi, Akazawa, Yuji
• Format: Patent
• Language: English
• Published: 02.06.2020
• Subjects: AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING; BASIC ELECTRIC ELEMENTS; CHEMISTRY; COMPOSITIONS BASED THEREON; COMPOSITIONS OF MACROMOLECULAR COMPOUNDS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INDEXING SCHEME ASSOCIATED WITH SUBCLASS B29C, RELATING TO PARTICULARARTICLES; INDEXING SCHEME ASSOCIATED WITH SUBCLASSES B29B, B29C OR B29D, RELATING TO MOULDING MATERIALS; METALLURGY; ORGANIC MACROMOLECULAR COMPOUNDS; PERFORMING OPERATIONS; SEMICONDUCTOR DEVICES; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDEDFOR; SHAPING OR JOINING OF PLASTICS; THEIR PREPARATION OR CHEMICAL WORKING-UP; TRANSPORTING; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE, IN GENERAL

A filling material for a resin composition includes a base material, a coating material coating at least a portion of a surface of a particle of the base material, and a light-reflective material disposed on the surface of the particle of the base material and supported by the coating material. The base material includes a first inorganic compound containing a Group II element. The coating material includes a second inorganic compound containing the Group II element. The second inorganic compound is different from the first inorganic compound. The light-reflective material includes a third inorganic compound having a refractive index higher than a refractive index of the first inorganic compound. A method of manufacturing the filling material is provided. A resin composition including the filling material, a package, a light-emitting device, and methods of manufacturing them are also provided.