Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling same
A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful c...
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Main Authors | , , , , |
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Format | Patent |
Language | English |
Published |
28.04.2020
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Subjects | |
Online Access | Get full text |
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Summary: | A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful compositions as well as shapes and sizes. |
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Bibliography: | Application Number: US201816018940 |