Semiconductor package substrate support structures for ball-grid array cavities, and methods of assembling same

A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful c...

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Bibliographic Details
Main Authors See, Chun Kit, Ong, Paik Wen, Goh, Eng Huat, Leong, Kean Huat, Tan, Sheng Jian Darren
Format Patent
LanguageEnglish
Published 28.04.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor package substrate has a cavity on the land side among the ball-grid array, and a support structure inserted into the cavity as well as covering at least one device that is seated on the land side. The cavity is an enclave or an exclave. The support structure takes on several useful compositions as well as shapes and sizes.
Bibliography:Application Number: US201816018940