Metal paste and thermoelectric module
The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which ad...
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Main Authors | , , |
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Format | Patent |
Language | English |
Published |
14.04.2020
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention relates to a metal paste including: a first metal powder including nickel (Ni); a second metal powder including at least one selected from the group consisting of tin (Sn), zinc (Zn), bismuth (Bi), and indium (In); and a dispersing agent, and to a thermoelectric module which adopts a bonding technique using the metal paste. |
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Bibliography: | Application Number: US201615766167 |