Semiconductor wafer with test key structure

A semiconductor wafer with a test key structure is provided. The semiconductor wafer includes a semiconductor substrate including a scribe line region, a chip region, and a seal ring region between the scribe line region and the chip region. A test pad structure and a test element are disposed over...

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Bibliographic Details
Main Authors Liao, Hsiu-Han, Chuang, Che-Fu
Format Patent
LanguageEnglish
Published 07.04.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor wafer with a test key structure is provided. The semiconductor wafer includes a semiconductor substrate including a scribe line region, a chip region, and a seal ring region between the scribe line region and the chip region. A test pad structure and a test element are disposed over the semiconductor substrate corresponding to the scribe line region. A conductive line is disposed over the semiconductor substrate corresponding to the seal ring region, and has two ends extending to the scribe line region and electrically connected between the test pad structure and the test element.
Bibliography:Application Number: US201816155496