Method of manufacturing circuit board

The present specification relates to a manufacturing method of a circuit board. More particularly, the present specification relates to a circuit board and a manufacturing method of an electronic device including the same.

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Bibliographic Details
Main Authors Son, Yong Goo, Lee, Seung Heon, Myung, Ji Eun, Seo, Han Min, Lim, Chang Yoon, Lee, Kiseok
Format Patent
LanguageEnglish
Published 31.03.2020
Subjects
APPARATUS SPECIALLY ADAPTED THEREFOR
BASIC ELECTRIC ELEMENTS
CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS
CINEMATOGRAPHY
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
ELECTROGRAPHY
HOLOGRAPHY
MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
MATERIALS THEREFOR
ORIGINALS THEREFOR
PHOTOGRAPHY
PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES,e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTORDEVICES
PHYSICS
PRINTED CIRCUITS
SEMICONDUCTOR DEVICES
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Summary:The present specification relates to a manufacturing method of a circuit board. More particularly, the present specification relates to a circuit board and a manufacturing method of an electronic device including the same.
Bibliography:Application Number: US201715741993