Semiconductor package with programmable signal routing

Semiconductor packages with programmable routing pathways are disclosed. The semiconductor package may have a source trace that may be electrically coupled to two or more different electrical pathways, where any of the electrical pathways may be activated to provide an electrical connection between...

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Bibliographic Details
Main Authors Ziakas, Dimitrios, Aoki, Russell S
Format Patent
LanguageEnglish
Published 10.03.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Semiconductor packages with programmable routing pathways are disclosed. The semiconductor package may have a source trace that may be electrically coupled to two or more different electrical pathways, where any of the electrical pathways may be activated to provide an electrical connection between the source trace and one or more destination nodes. Each of the electrical pathways may have a corresponding metal well with a correspond airgap overlying the metal well, as well as corresponding heating elements. If a particular heating element is energized, the heating element may melt metal in a corresponding metal well and the molten metal may migrate by capillary action into the overlying airgap to complete an electrical connection between the source trace and a destination node.
Bibliography:Application Number: US201616072219