Semiconductor die package and manufacturing method

In a general aspect, an apparatus can include a semiconductor die, a substrate, and a leadframe coupled to the substrate. The apparatus can include a conductive clip coupled to the semiconductor die. The leadframe can be disposed between the semiconductor die and the substrate, and the semiconductor...

Full description

Saved in:
Bibliographic Details
Main Authors Im, Seungwon, Jong, Mankyo, Son, Joonseo
Format Patent
LanguageEnglish
Published 10.03.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
Online AccessGet full text

Cover

More Information
Summary:In a general aspect, an apparatus can include a semiconductor die, a substrate, and a leadframe coupled to the substrate. The apparatus can include a conductive clip coupled to the semiconductor die. The leadframe can be disposed between the semiconductor die and the substrate, and the semiconductor die can be disposed between the conductive clip and the leadframe.
Bibliography:Application Number: US201715729973