Interconnection between printed circuit boards

• Main Authors: Rengarajan, Shanmugan, Subramaniam, Mahesh, Choudhuri, Debojyoti, Roy, Chayan
• Format: Patent
• Language: English
• Published: 03.03.2020
• Subjects: ANALOGOUS ARRANGEMENTS USING OTHER WAVES; ANTENNAS, i.e. RADIO AERIALS; BASIC ELECTRIC ELEMENTS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; DETERMINING DISTANCE OR VELOCITY BY USE OF RADIO WAVES; ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; LOCATING OR PRESENCE-DETECTING BY USE OF THE REFLECTION ORRERADIATION OF RADIO WAVES; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS; MEASURING; PHYSICS; PRINTED CIRCUITS; RADIO DIRECTION-FINDING; RADIO NAVIGATION; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE; TESTING; WAVEGUIDES

Disclosed is a method and device for interconnection of printed circuit boards operating at millimeter wave frequency band. The device comprises a primary printed circuit board, a secondary printed circuit board, an interconnection module for coupling electromagnetic energy from the primary printed circuit board to the secondary printed circuit board. The primary printed circuit board further comprising a primary top dielectric layer, specific via arrangements, a radio frequency chip, a primary high frequency transmission line connected to the radio frequency chip at one end and other end to a first inset-fed patch. The secondary printed circuit board further comprising a secondary top dielectric layer, specific via arrangements, a printed array antenna, a secondary high frequency transmission line connected to printed array antenna at one end, and other end to a second inset-fed patch. The interconnection module further comprising a first cut-out section, a second cut-out section and a slot.