Current sensor packages with through hole in semiconductor

• Main Authors: Seddon, Michael J, Wen, Yenting, Hall, Jefferson W
• Format: Patent
• Language: English
• Published: 25.02.2020
• Subjects: ELECTRICITY; MEASURING; MEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES; PHYSICS; TESTING

A semiconductor package includes a semiconductor die. A through hole in the semiconductor package and semiconductor die extends from one side of the semiconductor package and die to an opposite side of the semiconductor package and die. The through hole is configured to receive a current-carrying co...