Current sensor packages with through hole in semiconductor

A semiconductor package includes a semiconductor die. A through hole in the semiconductor package and semiconductor die extends from one side of the semiconductor package and die to an opposite side of the semiconductor package and die. The through hole is configured to receive a current-carrying co...

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Bibliographic Details
Main Authors Seddon, Michael J, Wen, Yenting, Hall, Jefferson W
Format Patent
LanguageEnglish
Published 25.02.2020
Subjects
ELECTRICITY
MEASURING
MEASURING ELECTRIC VARIABLES
MEASURING MAGNETIC VARIABLES
PHYSICS
TESTING
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Summary:A semiconductor package includes a semiconductor die. A through hole in the semiconductor package and semiconductor die extends from one side of the semiconductor package and die to an opposite side of the semiconductor package and die. The through hole is configured to receive a current-carrying conductor there through. At least one current sensor is formed in, or on, the semiconductor die and configured to sense current flow in the current-carrying conductor received in the through hole.
Bibliography:Application Number: US201816106638