Bond pads with surrounding fill lines

Bond pad structures and methods for fabricating bond pad structures. A bond pad and a plurality of fill lines are formed on the top surface of a dielectric layer. The fill lines are arranged on the top surface of the dielectric layer adjacent to the bond pad, and may be separated from the bond pad b...

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Bibliographic Details
Main Authors Pozder, Scott, Raman, Thiagarajan, Young-Fisher, Kristina, Stone, David
Format Patent
LanguageEnglish
Published 18.02.2020
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:Bond pad structures and methods for fabricating bond pad structures. A bond pad and a plurality of fill lines are formed on the top surface of a dielectric layer. The fill lines are arranged on the top surface of the dielectric layer adjacent to the bond pad, and may be separated from the bond pad by a fill keep-out zone. One or more Under Bump Metallurgy (UBM) layers may be arranged on the bond pad and may extend outwardly to overlap with the fill lines.
Bibliography:Application Number: US201815876734