Epoxy resin-epoxy curing systems with a latent thickening tendency

• Main Authors: Kockoth, Sascha, Pritschins, Wolfgang, Omeis, Jürgen, Piestert, Frederik
• Format: Patent
• Language: English
• Published: 11.02.2020
• Subjects: ADHESIVE PROCESSES NOT PROVIDED FOR ELSEWHERE; ADHESIVES; CHEMICAL PAINT OR INK REMOVERS; CHEMISTRY; COATING COMPOSITIONS, e.g. PAINTS, VARNISHES ORLACQUERS; COMPOSITIONS BASED THEREON; CORRECTING FLUIDS; DYES; FILLING PASTES; INKS; MACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONSONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS; METALLURGY; MISCELLANEOUS APPLICATIONS OF MATERIALS; MISCELLANEOUS COMPOSITIONS; NATURAL RESINS; NON-MECHANICAL ASPECTS OF ADHESIVE PROCESSES IN GENERAL; ORGANIC MACROMOLECULAR COMPOUNDS; PAINTS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; POLISHES; THEIR PREPARATION OR CHEMICAL WORKING-UP; USE OF INORGANIC OR NON-MACROMOLECULAR ORGANIC SUBSTANCES ASCOMPOUNDING INGREDIENTS; USE OF MATERIALS AS ADHESIVES; USE OF MATERIALS THEREFOR; WOODSTAINS

The invention relates to a two-component or multi-component system having at least one epoxy resin component (1) that comprises i. at least one epoxy resin, ii. at least one inorganic thickener (a1) and iii. at least one wetting and dispersing agent (a2) that inhibits the thickening effect of said inorganic thickener (a1); as well as a curing component (2) which comprises i.) at least one component (b1) that at least partially cancels the inhibition of the thickening effect of the inorganic thickener (a1); said wetting and dispersing agent (a2) being non-reactive to the at least one epoxy resin, and the curing component (2) being reactive to said epoxy resin component (1). The invention also relates to substrates coated with a two-component or multi-component system according to the invention. The invention also relates to the use of a combination of (a1) and (a2) in epoxy resin compositions, in order to give the formulation a latent thickening effect.