Vertical superconducting capacitors for transmon qubits

A vertical q-capacitor includes a trench in a substrate through a layer of superconducting material. A superconductor is deposited in the trench forming a first film on a first surface, a second film on a second surface, and a third film of the superconductor on a third surface of the trench. The fi...

Full description

Saved in:
Bibliographic Details
Main Authors Topaloglu, Rasit O, Rosenblatt, Sami, Hertzberg, Jared Barney, Rausch, Werner A
Format Patent
LanguageEnglish
Published 04.02.2020
Subjects
BASIC ELECTRIC ELEMENTS
CALCULATING
CAPACITORS
CAPACITORS, RECTIFIERS, DETECTORS, SWITCHING DEVICES ORLIGHT-SENSITIVE DEVICES, OF THE ELECTROLYTIC TYPE
COMPUTER SYSTEMS BASED ON SPECIFIC COMPUTATIONAL MODELS
COMPUTING
COUNTING
ELECTRICITY
PHYSICS
Online AccessGet full text

Cover

More Information
Summary:A vertical q-capacitor includes a trench in a substrate through a layer of superconducting material. A superconductor is deposited in the trench forming a first film on a first surface, a second film on a second surface, and a third film of the superconductor on a third surface of the trench. The first and second surfaces are substantially parallel, and the third surface in the trench separates the first and second surfaces. A dielectric is exposed below the third film by etching. A first coupling is formed between the first film and a first contact, and a second coupling is formed between the second film and a second contact in a superconducting quantum logic circuit. The first and second couplings cause the first and second films to operate as the vertical q-capacitor that maintains integrity of data in the superconducting quantum logic circuit within a threshold level.
Bibliography:Application Number: US201916374505