Semiconductor package including titanium oxide layer and method for manufacturing the same

A semiconductor package includes a substrate, a semiconductor element disposed on the substrate, an encapsulating layer covering side surfaces and a top surface of the semiconductor element, an electromagnetic shield layer covering side surfaces of the substrate and side surfaces and a top surface o...

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Bibliographic Details
Main Author Takano, Yuusuke
Format Patent
LanguageEnglish
Published 28.01.2020
Subjects
BASIC ELECTRIC ELEMENTS
COLOUR PRINTING
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
LINING MACHINES
PERFORMING OPERATIONS
PRINTING
PRINTING, DUPLICATING, MARKING, OR COPYING PROCESSES
SEMICONDUCTOR DEVICES
STAMPS
TRANSPORTING
TYPEWRITERS
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Summary:A semiconductor package includes a substrate, a semiconductor element disposed on the substrate, an encapsulating layer covering side surfaces and a top surface of the semiconductor element, an electromagnetic shield layer covering side surfaces of the substrate and side surfaces and a top surface of the encapsulating layer, and a titanium oxide layer formed above a top surface of the electromagnetic shield layer, and including a first portion containing divalent titanium oxide and a second portion containing tetravalent titanium oxide.
Bibliography:Application Number: US201715693395