Gas supply unit and thin film deposition apparatus including the same

• Main Authors: Jung, Min Hwa, Heo, Jin Pil, Shin, Jae chul, Lee, Jong Cheol, Chung, Suk Jin
• Format: Patent
• Language: English
• Published: 07.01.2020
• Subjects: BASIC ELECTRIC ELEMENTS; CHEMICAL SURFACE TREATMENT; CHEMISTRY; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATIONOR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY IONIMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; COATING MATERIAL WITH METALLIC MATERIAL; COATING METALLIC MATERIAL; DIFFUSION TREATMENT OF METALLIC MATERIAL; ELECTRIC DISCHARGE TUBES OR DISCHARGE LAMPS; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR; ELECTRICITY; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION INGENERAL; METALLURGY; SEMICONDUCTOR DEVICES; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THESURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION

A gas supply unit includes a base plate, a plurality of gas supply regions protruding from the base plate and arranged on the base plate in a circumferential direction, and a plurality of sidewall trenches alternating with the gas supply regions on the base plate. A distance between opposing surfaces of the base plate increases in a radial direction from a center of the base plate in each of the plurality of sidewall trenches, so each of the plurality of sidewall trenches has a depth that decreases in the radial direction from the center of the base plate.