Contact structures

The present disclosure relates to semiconductor structures and, more particularly, to a contact over an active gate structure and methods of manufacture. The structure includes: an active gate structure composed of conductive material located between sidewall material; an upper sidewall material abo...

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Bibliographic Details
Main Authors Wu, Xusheng, Zhang, John H, Huang, Haigou, Economikos, Laertis, Shu, Jiehui, Liu, Pei
Format Patent
LanguageEnglish
Published 17.12.2019
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Summary:The present disclosure relates to semiconductor structures and, more particularly, to a contact over an active gate structure and methods of manufacture. The structure includes: an active gate structure composed of conductive material located between sidewall material; an upper sidewall material above the sidewall material, the upper sidewall material being different material than the sidewall material; and a contact structure in electrical contact with the conductive material of the active gate structure. The contact structure is located between the sidewall material and between the upper sidewall material.
Bibliography:Application Number: US201815878081