Electronic component supply body and method for manufacturing the same
An electronic component supply body and a method for manufacturing the same, which can suppress generation of wrinkles of an adhesive sheet and is unlikely to cause pickup failure of electronic component chips to occur. The supply body includes an adhesive sheet with an adhesive layer formed with an...
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Main Authors | , |
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Format | Patent |
Language | English |
Published |
03.12.2019
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Subjects | |
Online Access | Get full text |
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Summary: | An electronic component supply body and a method for manufacturing the same, which can suppress generation of wrinkles of an adhesive sheet and is unlikely to cause pickup failure of electronic component chips to occur. The supply body includes an adhesive sheet with an adhesive layer formed with an ultraviolet-curing adhesive, a ring frame bonded onto the adhesive sheet, and electronic component chips bonded onto a first region on the adhesive sheet superimposed with the opening of the ring frame. The second cured portions that are cured by being irradiated with ultraviolet rays are provided in a part of a second region forming a bonded portion between the adhesive sheet and the ring frame. Adhesive strength in the second cured portions in a shearing direction is larger than adhesive strength in a portion of the second region other than the second cured portions. |
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Bibliography: | Application Number: US201615231892 |