Package structure and manufacturing method thereof

A package structure includes a redistribution layer, at least one bonding electrode, and a mounting layer. The redistribution layer has a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface. The bondi...

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Bibliographic Details
Main Authors Chou, Hsueh-Hsuan, Fan, Chia-Chieh, Wang, Kuan-Jen, Wang, Cheng-Chi
Format Patent
LanguageEnglish
Published 26.11.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A package structure includes a redistribution layer, at least one bonding electrode, and a mounting layer. The redistribution layer has a first surface, a second surface disposed opposite to the first surface, and at least one sidewall connected to the first surface and the second surface. The bonding electrode is disposed on the first surface of the redistribution layer. The mounting layer is disposed on the second surface of the redistribution layer. The mounting layer includes a plurality of conductive pads spaced apart from each other, wherein at least one of the conductive pads is exposed by the sidewall of the redistribution layer.
Bibliography:Application Number: US201715854728