Electrically conducting assemblies

The present invention pertains to a process for the manufacture of a multilayer assembly comprising applying at least one patterned substrate onto at least one surface of at least one non-patterned substrate. The present invention also pertains to the multilayer assembly obtainable by said process a...

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Bibliographic Details
Main Authors Cojocaru, Paula, Falco, Ivan, Apostolo, Marco, Marrani, Alessio
Format Patent
LanguageEnglish
Published 22.10.2019
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Summary:The present invention pertains to a process for the manufacture of a multilayer assembly comprising applying at least one patterned substrate onto at least one surface of at least one non-patterned substrate. The present invention also pertains to the multilayer assembly obtainable by said process and to uses of said multilayer assembly in various applications.
Bibliography:Application Number: US201414917172