Electrically conducting assemblies
The present invention pertains to a process for the manufacture of a multilayer assembly comprising applying at least one patterned substrate onto at least one surface of at least one non-patterned substrate. The present invention also pertains to the multilayer assembly obtainable by said process a...
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Main Authors | , , , |
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Format | Patent |
Language | English |
Published |
22.10.2019
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Subjects | |
Online Access | Get full text |
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Summary: | The present invention pertains to a process for the manufacture of a multilayer assembly comprising applying at least one patterned substrate onto at least one surface of at least one non-patterned substrate. The present invention also pertains to the multilayer assembly obtainable by said process and to uses of said multilayer assembly in various applications. |
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Bibliography: | Application Number: US201414917172 |