Semiconductor substrate and semiconductor packaging device, and method for forming the same

A semiconductor substrate includes a first dielectric layer, a first patterned conductive layer disposed in the first dielectric layer, a second dielectric layer disposed on the first dielectric layer, and a first bump pad disposed in the second dielectric layer. The first bump pad is electrically c...

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Bibliographic Details
Main Authors Tsai, Li Chuan, Lee, Chih-Cheng
Format Patent
LanguageEnglish
Published 15.10.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:A semiconductor substrate includes a first dielectric layer, a first patterned conductive layer disposed in the first dielectric layer, a second dielectric layer disposed on the first dielectric layer, and a first bump pad disposed in the second dielectric layer. The first bump pad is electrically connected to the first patterned conductive layer, and the first bump pad has a curved surface surrounded by the second dielectric layer.
Bibliography:Application Number: US201715450598