Electronic package with tapered pedestal

An electrical package may comprise a first substrate with a first substrate surface, and a microprocessor chip connected to the first substrate surface. The microprocessor chip may comprise a first chip surface that electrically connects to the first substrate surface, and a second chip surface loca...

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Bibliographic Details
Main Authors Sikka, Kamal K, Tunga, Krishna R, Weiss, Thomas, Toy, Hilton T
Format Patent
LanguageEnglish
Published 24.09.2019
Subjects
BASIC ELECTRIC ELEMENTS
ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
ELECTRICITY
SEMICONDUCTOR DEVICES
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Summary:An electrical package may comprise a first substrate with a first substrate surface, and a microprocessor chip connected to the first substrate surface. The microprocessor chip may comprise a first chip surface that electrically connects to the first substrate surface, and a second chip surface located opposite the first chip surface. The electrical package may comprise a heat spreader assembly that comprises a lid section and a contact surface thermally connected to the second-chip surface. The electrical package may also comprise a pedestal between the contact surface and the lid section. The pedestal may comprise a first end that is located near the contact surface and a second end that is located near the lid section. The second end may be wider than the first end.
Bibliography:Application Number: US201715812290